Group 71 -- Summer Research Program Intern (Mechanical Engineering)
MIT Lincoln Laboratory | |
United States, Massachusetts, Lexington | |
244 Wood Street (Show on map) | |
Oct 30, 2024 | |
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Apply now Date: Oct 30, 2024 Location: Company: The Mechanical Engineering Group provides innovative mechanical solutions for a wide range of advanced technologies. Our work has been in the areas of laser communication, high-energy lasers, telescopes, biomechanical materials, hypersonics, and radars, for systems deployed on ground, maritime, air- and space-borne platforms. We have expertise in precision engineering, opto-mechanisms, electronics packaging, large structures, composite materials, and additive manufacturing. We are the Engineering Division's center for 3D design and data management, and are involved in every step of a program's execution from conceptual design to system integration and test. Job Description
The group seeks a summer research program intern to assist technical staff members with cutting-edge research and program execution in the Mechanical/Aerospace engineering. Duties could include:
In addition to specific technical tasks, an employment experience at Lincoln Laboratory offers:
The successful candidate will be enrolled in an undergraduate degree program of study in Mechanical Engineering, Aeronautics/Astronautics, Aerospace Engineering, Civil Engineering, or Physics and have completed Mechanics of Materials or equivalent class. CAD, finite element analysis or prototyping experience is preferred, but not required. Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance. MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required. Requisition ID: 41637
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