Package Reliability Engineer

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

• Reliability Analysis & Risk Assessment:

  • Conduct physics of failure (PoF)-based reliability modeling for 2.5D/3D advanced packaging.

  • Assess package reliability risks from thermal, mechanical, and electrical stressors.

  • Define and execute stress test plans (e.g., thermal cycling, humidity, electromigration) to validate package robustness.

• OSAT Management & Collaboration:

  • Work closely with OSAT partners to drive package reliability improvements, process optimizations, and yield enhancements.

  • Define reliability requirements, review test methodologies, and ensure OSAT compliance with JEDEC and industry standards.

  • Monitor and evaluate OSAT performance in executing reliability qualifications and failure analysis.

  • Support supplier audits and technical reviews to assess manufacturing capabilities and reliability processes.

• Material Characterization & Selection:

  • Evaluate and select materials (substrates, dielectrics, adhesives, underfills) for optimal reliability.

  • Analyze CTE mismatches, warpage, delamination, and interfacial adhesion issues.

  • Work with material suppliers and OSATs to qualify new materials for advanced packaging applications.

• Failure Analysis & Root Cause Identification:

  • Lead failure mode analysis (FMEA), model-based problem solving (MBPS)and determine root causes of package failures using techniques such as FIB, X-ray, SEM, and TEM.

  • Identify and mitigate interfacial failures, cracking, voiding, electromigration, and stress-induced damage.

  • Drive OSATs and internal teams to implement corrective and preventive actions (CAPA).

• Process & Design Collaboration:

  • Work cross-functionally with internal design, process, and manufacturing teams to define assembly test vehicles andoptimize package architectures.

  • Develop and refine design guidelines, process improvements, and reliability best practices.

  • Stay up to date with industry standards (JEDEC, IPC, IEEE, etc.) and implement best practices in package reliability.

What We're Looking For

• Education:Master's or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Applied Physics, or a related field.

• Experience:5-10 years of hands-on experience in 2.5D/3D advanced packaging reliability.

• Technical Expertise:

  • Deep understanding of physics of failure (PoF) methodologies for package reliability.

  • Strong knowledge of materials science, particularly in interconnects, substrates, and interfaces.

  • Proficiency in stress modeling tools (ANSYS, Abaqus, COMSOL, etc.) for thermo-mechanical analysis.

  • Experience with failure analysis techniques such as C-SAM,X-ray CT, SEM, TEM, FIB, and EBSD.

• OSAT Collaboration Experience:

  • Proven track record of working with and driving OSAT partners for package reliability, yield, and continuousquality improvements.

  • Experience managing OSAT qualifications, failure analysis, and corrective actions.

  • Familiarity with supplier engagement, reliability testing at OSATs, and package process flows.

• Industry Knowledge:Familiarity with JEDEC, IPC, IEEE, and MIL-STD reliability standards.

• Soft Skills:Strong analytical, problem-solving, and cross-functional collaboration skills.

PREFERRED QUALIFICATIONS

• Experience in heterogeneous integration, fan-out packaging, chiplet architectures.

• Knowledge of electrical reliability mechanisms (e.g., electromigration, time-dependent dielectric breakdown).

• Expertise in AI-driven reliability modeling or machine learning for failure prediction.

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.