Microelectronics Fabrication & Process Integration Engineer, MOSIS 2.0
University of Southern California | |
$158,000 - $180,000
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United States, California, Los Angeles | |
Apr 23, 2026 | |
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ESSENTIAL FUNCTIONS * Support semiconductor prototyping projects from technical intake through fabrication, metrology, packaging coordination, and production handoff. MINIMUM QUALIFICATIONS* Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field and 5+ years of industrial semiconductor fabrication experience; PREFERRED QUALIFICATIONS * Master's degree in a related field and 2+ years of industrial semiconductor fabrication experience; OR * Hands-on experience in micro- or nanofabrication (lithography, deposition, etch, metrology) The annual base salary range for this position is $158,000 - $180,000. When extending an offer of employment, the University of Southern California considers factors such as (but not limited to) the scope and responsibilities of the position, the candidate's work experience, education/training, key skills, internal peer equity, federal, state and local laws, contractual stipulations, grant funding, as well as external market and organizational considerations. MOSIS 2.0 seeks a Microelectronics Fabrication & Process Integration Engineer to translate innovative semiconductor process designs into fabricated and packaged hardware through a network of university and industry fabrication partners. This hybrid, customer-facing role supports semiconductor process prototyping projects from technical intake through fabrication and production handoff, coordinates with partner nanofabrication and packaging facilities, and contributes to data-driven process optimization initiatives. Job ID REQ20173556
Posted Date 04/22/2026 Apply
Current employees apply here | |
$158,000 - $180,000
Apr 23, 2026