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Microelectronics Fabrication & Process Integration Engineer, MOSIS 2.0

University of Southern California
$158,000 - $180,000
United States, California, Los Angeles
Apr 23, 2026

ESSENTIAL FUNCTIONS

* Support semiconductor prototyping projects from technical intake through fabrication, metrology, packaging coordination, and production handoff.
* Translate customer requirements into executable fabrication process plans and assist with feasibility assessments.
* Serve as a technical liaison to partner university nanofabrication facilities and industry fabs; participate in recurring technical progress reviews.
* Assist with process development, recipe documentation, troubleshooting, and yield improvement efforts in nanofabrication environments.
* Coordinate wafer-to-package transitions and collaborate with packaging partners on assembly and test requirements.
* Support process transfer and readiness assessments across partner facilities.
* Collaborate with internal research teams on data-driven process optimization and AI/ML-enabled manufacturing analytics.
* Maintain documentation of process flows, metrology results, and partner capabilities.

MINIMUM QUALIFICATIONS* Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field and 5+ years of industrial semiconductor fabrication experience;
* Working knowledge of semiconductor device physics and fabrication fundamentals.
* Experience supporting process development, troubleshooting, or yield improvement in a fabrication facility.
* Strong written and verbal communication skills and ability to collaborate across technical teams.
* Candidate must be a U.S. Person (U.S. citizen or lawful permanent resident).

PREFERRED QUALIFICATIONS

* Master's degree in a related field and 2+ years of industrial semiconductor fabrication experience; OR
* PhD in a related field with 0-5 years of post-degree experience.

* Hands-on experience in micro- or nanofabrication (lithography, deposition, etch, metrology)

The annual base salary range for this position is $158,000 - $180,000. When extending an offer of employment, the University of Southern California considers factors such as (but not limited to) the scope and responsibilities of the position, the candidate's work experience, education/training, key skills, internal peer equity, federal, state and local laws, contractual stipulations, grant funding, as well as external market and organizational considerations.


MOSIS 2.0 seeks a Microelectronics Fabrication & Process Integration Engineer to translate innovative semiconductor process designs into fabricated and packaged hardware through a network of university and industry fabrication partners.
This hybrid, customer-facing role supports semiconductor process prototyping projects from technical intake through fabrication and production handoff, coordinates with partner nanofabrication and packaging facilities, and contributes to data-driven process optimization initiatives.
Job ID REQ20173556
Posted Date 04/22/2026
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